Product Categories
Contact Us

Joint Peace Lighting Co., Limited

ADD:No.4, Lane9, Tongpai East,Tianan Park Bantian,Longgang District,Shenzhen China 518129.

Contact:Annie (Sales Director)

Mobile:86-13423745087

E-mail: annie@joinpeled.com

www.joinpeled.com

www.jopeled.com


Exhibition

Tsmc Will Put into Production Uncased LED Illuminant

Abstract: TSMC Solid State Lighting in the later part of the year will put into production uncased LED, saving cost to the LED illuminate packaging sector.

TSMC Solid State Lighting in the later part of the year will put into production uncased LED, saving cost to the LED illuminate packaging sector. TSMC Solid State Lighting President Dr. Jacob Tarn pointed out that the future of indoor lighting has become a large portion of the LED lighting supply market. This has caused competition within LED factories, making product prices being the key to market success.

TSMC Solid State Lighting President Dr. Jacob Tarn expressed that in near future, the selling point of LED bulbs already released by Cree has dropped as low as 10 USD. However, this has still not sparked a fierce purchase aspiration in end consumers , clearly showing the future still has a lot of room for prices to drop. For the purpose of strengthening the GaN-on-Silicon and sapphire substrate division of LED production line’s price competition, TSMC Solid State Lighting has already decided at the end of the year to produce new LED light source(without package, like COB).

It is understood that in the current stage, TSMC Solid State Lighting GaN-on-Silicon and sapphire substrate LED production line revenue is 50%, differentiated by using high-power and low-power LEDs. Among these, the plan for the high-power LED is to adopt a no wire COB (Chip on Board) packaging technology plan, and for the low-powered LEF to use Flip Chip packaging technology.

President Dr. Jacob Tarn pointed out that high-powered LED supplier, via the selection of lower thermal resistance substrate and reduce packaging thermal resistance, are their two main methods for increasing the high-powered LED’s heat dissipation performance. From TSMC Solid State Lighting’s perspective, the current heat dissipation performance GaN-on-Silicon's technology volume of production for the high-powered LED has adopted the use of non-wired COB packaging technology in order to reduce thermo resistance packaging. Eliminating packaging manufacturing will help break away from the decreased thermal resistance packaging technology problem in the future.

It is reported that, aside from TSMC Solid State Lighting, the LED company Cree is also aggressively developing new LED light source(without package), however has yet to set a production date. Therefore, once TSMC Solid State Lighting at the end of the year smoothly enters into mass production, it will become the world’s first mass production supplier to provide uncased LED illuminate.

Following TSMC Solid State Lighting and other LED manufacturers already entering into production of new LED light source(without package). the LED packaging market living space could possibly become reduced, even leading to future LED production environment to drastically change. However, President Dr. Jacob Tarn emphasizes that if LED is to realize widespread popularization, relying on packaged LED illuminate to achieve a lower overall production cost is imperative.

Source: http://english.gg-led.com/